Alpha Metals RF800T
No-Clean Flux
FEATURES BENEFITS
• Medium Solids Content • Pin Testable
• Non Corrosive Residues • High Sir Assemblies
DE
Alpha RF 800T is a low solids, no-clean flux formulated with a small percentage of rosin and non-halide
activators. This unique rosin activation system promotes excellent wetting to protected copper and solder coated
surfaces. Post soldering residue of Alpha RF 800T is minimal, slightly glossy and can be pin tested without
removal.
USE
Alpha RF 800T flux is formulated to be applied with foam, wave, spray and mist fluxers. Flux deposition, density
and uniformity are critical to successful use of low solids no-clean flux. Applying RF 800T to a dry flux coating
density of 100 to 300 micrograms per square centimetre is recommended. Preheating the circuit assembly will
partially dry the flux, enhance oxide removal and promote optimum wicking, as well as superior solder joint
formation. Degree of preheat is dependent on many variables; such as conveyor speed, type of components and
substrates. Entering the solder wave with a top-side temperature of 90°C to 110°C and a bottom-side
temperature of 120°C to 155°C is typical.
The foam applicators should be supplied with compressed air, free of oil and water. Maintain flux fluid level
sufficiently above the aerator to produce adequate foam height. Adjust air pressure to produce optimum height
with foam consisting of uniform bubbles. The addition of flux thinners will be required to replace evaporative
losses and maintain the balance in flux composition. Due to the low solids content of Alpha RF 800T flux,
specific gravity is not an accurate measure for assessment. Monitoring and controlling the acid number is
recommended for maintaining the flux composition. The acid number should be controlled between 21 and 22.
